The Thermalright TF7 2g Thermal Compound Paste delivers exceptional heat transfer performance for CPUs, GPUs, and all processors. With a high thermal conductivity of 12.8 W/m·K, this premium, non-conductive paste ensures efficient cooling while keeping your components safe. Its low thermal impedance (<0.01 °C·cm²/W) maximizes heat dissipation, reducing CPU and GPU temperatures during heavy workloads or gaming sessions.
The 2 g size is ideal for single or multiple applications, and the included spatula tool ensures easy, even spreading without mess. The TF7 paste is non-corrosive, non-conductive, and capable of handling extreme temperatures from –150 °C to +250 °C, making it perfect for high-performance builds, overclocking, or workstation setups.
Key Features:
-
High thermal conductivity: 12.8 W/m·K
-
Non-conductive & safe for all electronic components
-
Low thermal impedance for maximum heat transfer
-
Wide temperature range: –150 °C to +250 °C
-
Comes with a spatula for precise application
-
Ideal for CPU, GPU, and other processor cooling